Highly-functional Material Week - Osaka Show
May 14 - 16, 2025
INTEX Osaka, Japan

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We offer unique heat-curing adhesives based on our own compounding technology. To meet a variety of needs, we have a lineup of products, including ultra-fast curing and ultra-heat resistant.
Products and Services
  • Adhesion & Bonding Expo [Osaka]
A stirring defoaming machine is a device that stirs and defoams by rotating and revolving at high speed. We have a lineup ranging from small-volume types to large-volume types.
Products and Services
  • Adhesion & Bonding Expo [Osaka]
We will showcase void-free soldering techniques , ultrasonic metal bonding devices for EV harnesses in electrified vehicles, and high-capacity inverter-type resistance welding machines.
Products and Services
  • Adhesion & Bonding Expo [Osaka]
Highly-functional Material Week - Osaka Show